Product Summary

The Spartan and the Spartan-XL FPGA XCS30-3PQG208C is a high-volume production FPGA solution that delivers all the key requirements for ASIC replacement up to 40,000 gates. The XCS30-3PQG208C requirements include high performance, on-chip RAM, core solutions and prices that, in high volume, approach and in many cases are equivalent to mask programmed ASIC devices. By streamlining the Spartan series feature set, leveraging advanced process technologies and focusing on total cost management, the Spartan series delivers the key features required by ASIC and other high-volume logic users while avoiding the initial cost, long development cycles and inherent risk of conventional ASICs.

Parametrics

XCS30-3PQG208C absolute maximum ratings: (1)VCC Supply voltage relative to GND: -0.5 to +7.0 V; (2)VIN Input voltage relative to GND(2,3): -0.5 to VCC +0.5 V; (3)VTS Voltage applied to 3-state output(2,3): -0.5 to VCC +0.5 V; (4)TSTG Storage temperature (ambient): -65 to +150 ℃; (5)TJ Junction temperature Plastic packages: +125 ℃.

Features

XCS30-3PQG208C features: (1)First ASIC replacement FPGA for high-volume production with on-chip RAM; (2)Density up to 1862 logic cells or 40,000 system gates; (3)Streamlined feature set based on XC4000 architecture; (4)System performance beyond 80 MHz; (5)Broad set of AllianceCORE and LogiCORE predefined solutions available; (6)Unlimited reprogrammability; (7)Low cost; (8)3.3V supply for low power with 5V tolerant I/Os; (9)Power down input; (10)Higher performance; (11)Faster carry logic; (12)More flexible high-speed clock network; (13)Latch capability in Configurable Logic Blocks; (14)Input fast capture latch; (15)Optional mux or 2-input function generator on outputs; (16)12 mA or 24 mA output drive; (17)5V and 3.3V PCI compliant; (18)Enhanced Boundary Scan; (19)Express Mode configuration.

Diagrams

XCS30-3PQG208C Block Diagram

XCS30 and XCS30XL
XCS30 and XCS30XL

Other


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